Exhibiting for the first time at Construct, HPS Schönox is bringing new technologies and products to the commercial building sector that will expand the ability to install more diverse floor coverings over critical subfloors. The company’s full line of primers, floor leveling compounds, repair mortars, and adhesives will be presented at the show.  Product solutions that address moisture issues, damaged substrates, wood subfloors, and renovating rather than demolishing subfloors will be debuted.

“Specifying the subfloor materials that will support the overall flooring installation is so important that we wanted to come to Construct to talk directly with the professionals who make those critical decisions,” explained Enos Farnsworth, president of HPS North America, Inc. “Time after time we find that specifiers, commercial building teams, and architects clearly understand the value of the innovative products that Schönox is making available to solve subfloor challenges.” A series of Schönox self leveling compounds are made from synthetic gypsum that is created from the by-product of the process used to purify emissions from power plants. These leveling compounds can go over many critical and damaged subfloors, dry to an outstanding 5400+ PSI, and contribute to LEED credits.

“Our conversations with specifiers are about technology and how it can be applied for stronger, more efficient subfloor projects,” said Karen Bellinger, HPS Schönox Business Development. Special properties in Schönox AP (self leveling compound) and AST (smoothing and patching compound) help reduce the amount of dust created when mixing and using these products inside of facilities that are in active use. Schönox is now offering products in the flooring adhesive and waterproofing areas that can be installed using rollers from a standing position.  

“The research and development division at Schönox is continuously addressing ways to improve products,” commented Russell Wright, HPS Schönox Regional Business Manager Southeast.  “The silane technology in our MSP Classic wood floor adhesive is a great example where the product’s elastomeric properties allow movement as the wood expands and contracts with fluctuating temperature and humidity.”  Silane modified polymers within MSP Classic create a tenacious bond to all types of wood flooring and a wide variety of substrates, the company said.

“We believe the Construct show will become a regular event for HPS Schönox,” explained Farnsworth. “Schönox has a number of solutions that will assist commercial, industrial, and institutional building specifiers and at the same time we want to hear more from them regarding their challenges and opportunities in the field.”